Renewable Design for Automatic Assembly Machine - Max 300 Degree High Temperature Microfluidic Chip Vacuum Thermocompression Bonding Machine – Jiutu

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Max 300 Degree High Temperature Microfluidic Chip Vacuum Thermocompression Bonding Machine Function : Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in j...


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Renewable Design for Automatic Assembly Machine - Max 300 Degree High Temperature Microfluidic Chip Vacuum Thermocompression Bonding Machine – Jiutu Detail:

Max 300 Degree High Temperature Microfluidic Chip Vacuum Thermocompression Bonding Machine

Function :

Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic

Specification :
Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.
Application :
Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.

 

 


Product detail pictures:

Renewable Design for Automatic Assembly Machine -
 Max 300 Degree High Temperature Microfluidic Chip Vacuum Thermocompression Bonding Machine – Jiutu detail pictures

Renewable Design for Automatic Assembly Machine -
 Max 300 Degree High Temperature Microfluidic Chip Vacuum Thermocompression Bonding Machine – Jiutu detail pictures

Renewable Design for Automatic Assembly Machine -
 Max 300 Degree High Temperature Microfluidic Chip Vacuum Thermocompression Bonding Machine – Jiutu detail pictures

Renewable Design for Automatic Assembly Machine -
 Max 300 Degree High Temperature Microfluidic Chip Vacuum Thermocompression Bonding Machine – Jiutu detail pictures

Renewable Design for Automatic Assembly Machine -
 Max 300 Degree High Temperature Microfluidic Chip Vacuum Thermocompression Bonding Machine – Jiutu detail pictures


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Well-run devices, expert profits group, and better after-sales companies; We have been also a unified huge family, everybody keep on with the organization worth "unification, determination, tolerance" for Renewable Design for Automatic Assembly Machine - Max 300 Degree High Temperature Microfluidic Chip Vacuum Thermocompression Bonding Machine – Jiutu, The product will supply to all over the world, such as: Surabaya , Bogota , Victoria , Our company abides by the management idea of "keep innovation, pursue excellence". On the basis of assuring the advantages of existing products, we continuously strengthen and extend product development. Our company insists on innovation to promote the sustainable development of enterprise, and make us become the domestic high-quality suppliers.
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