Press Bonding Machine for hard glass TFT OLED IC COF Flexible Display IC, PFC Cable, PCB Board FPC Cable ACF Process Pressing
Press Bonding Machine for hard glass TFT OLED IC COF Flexible Display IC, PFC Cable, PCB Board FPC Cable ACF Process Pressing
| Power | AC220V 50HZ |
| Equipment power | 1.5KW |
|
Indenter material |
Tungsten steel |
| Pressure head specifications | customizable |
| Pressure accuracy | 0.001Mpa |
| Working air source | 0.5MPa—0.6MPa |
| Air supply pressure | 4-6Kgf/cm² |
| Heating method | Constant temperature heating |
| Temperature feedback | K type thermocouple |
| Pressure head temperature range | Normal temperature -400℃ (can be set) |
| Platform temperature range | Normal temperature -80℃ (can be set) |
| Productivity | 20S/PCS (depending on ACF parameters) |
| time setting | 0.1~99.0S |
| Process flow | 1) When the device is powered on, the device enters the automatic interface and returns to the origin; |
| 2) Place the product on the platform and turn on the vacuum, | |
| 3) Press the vacuum + start button to start the equipment to automatically carry out the pressure. | |
| 4) After the pressing time is up, the pressure head rises and the tape winding is completed; | |
| 5) The operator takes out the pressed product; | |
| 6) Repeat actions 2)~5) to produce the next product; |
Product usage:
This equipment is suitable for hard glass (TFT or OLED) pressing IC, hard glass pressing COF, flexible display pressing IC, PFC cable binding IC, PCB board binding FPC cable (ACF process), etc.
This equipment is a semi-automatic servo heat press. It is a device for hot pressing TFT/LCD/OLED/PCB boards, etc., on a Panel that has attached conductive film (ACF) and pre-pressed IC/COF/FPC. Picking and placing is done manually, while hot pressing, timing and tape reeling are done automatically by equipment.
