OEM Supply Glass Cover Replacement For Iphone 6g - Microfluidic Chip Vacuum Hot Pressing Bonding Machine For PC PP COP Rigid to Rigid Bonding – Jiutu

Short Description:

Microfluidic Chip Vacuum Hot Pressing Bonding Machine For PC PP COP Rigid to Rigid Bonding Function : Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in ju...

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Well-run equipment, professional sales team, and better after-sales services; We are also a unified big family, everyone stick to the company value "unification, dedication, tolerance" for Front Glass With Bezel Frame , Pulse Pressing Machine , Oca Laminator Machine , We have been wanting ahead to setting up cooperative associations along with you. Make sure you contact us for more data.

OEM Supply Glass Cover Replacement For Iphone 6g - Microfluidic Chip Vacuum Hot Pressing Bonding Machine For PC PP COP Rigid to Rigid Bonding – Jiutu Detail:

Microfluidic Chip Vacuum Hot Pressing Bonding Machine For PC PP COP Rigid to Rigid Bonding

Function :

Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic

Specification :

Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.

Application :

Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.

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With this motto in mind, we have turn out to be amongst probably the most technologically innovative, cost-efficient, and price-competitive manufacturers for OEM Supply Glass Cover Replacement For Iphone 6g - Microfluidic Chip Vacuum Hot Pressing Bonding Machine For PC PP COP Rigid to Rigid Bonding – Jiutu, The product will supply to all over the world, such as: Karachi , Thailand , Rwanda , We have established long-term, stable and good business relationships with many manufacturers and wholesalers around the world. Currently, we are looking forward to even greater cooperation with overseas customers based on mutual benefits. Please feel free to contact us for more details.

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The sales manager has a good English level and skilled professional knowledge, we have a good communication. He is a warm and cheerful man, we have a pleasant cooperation and we became very good friends in private.