OEM China Vacuum Separator - Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu – Jiutu

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Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu Function : The length of the cutter head of the product can be customized within 90mm*width of 5mm; the temperature can be set at 0-450 degrees, and the pressure can be adjusted from 0-0.6mpa. The platform has a pre-heating function, and the camera can be positioned up or down according to the requirements, and the lens multiples can be configured according to the samples provided by the customer. Main Features : The constant...

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With sophisticated technologies and facilities, strict top quality handle, reasonable value, exceptional support and close co-operation with clients, we are devoted to furnishing the ideal worth for our clients for Lcd Separator Freezer , Air Bubble Removing Machine , Repair Machine For Phone , We look forward to establish a long-term business relationship with your esteem co-operation.

OEM China Vacuum Separator - Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu – Jiutu Detail:

Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu

Function :

The length of the cutter head of the product can be customized within 90mm*width of 5mm; the temperature can be set at 0-450 degrees, and the pressure can be adjusted from 0-0.6mpa. The platform has a pre-heating function, and the camera can be positioned up or down according to the requirements, and the lens multiples can be configured according to the samples provided by the customer.

Main Features :

The constant temperature heating method is adopted, and the main structure is made of 45# steel with high precision and good stability. Using Japanese SMC cylinder + precision pressure regulating valve to precisely control the pressing force. Imported thermal insulation module and special tungsten steel cutter head are used for durability and high temperature accuracy. HD auxiliary alignment system.

Working principle :The ACF glue process is mainly used to bind the chip, FPC or FFC cable together according to the pressure, temperature and time parameters of the ACF glue. According to the equivalent force and temperature output by the hot press, the ACF particles are hot-pressed and blasted at a certain time, so as to achieve the purpose of vertical conduction and horizontal non-conduction.

Working area :

1,Mobile phone cable binding field,

2,medical field,

3,laboratory research and development test

Model	FPC/FFC bonding machine
P/N	9TU-M039A
Heating Method	Pulse heating
Working Tempature	0℃ to 500℃
Working Humidity	40%–95%RH
Working Rated Power	2500W
Machine Size	645557CM
Net Weight	85kg
Working Pressure	4–6kgf/cm2
Working Pressure	0.4-0.8Mpa
Volatge,Power Supply	220V 50Hz

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With advanced technologies and facilities, strict quality control, reasonable price, superior service and close co-operation with customers, we are devoted to providing the best value for our customers for OEM China Vacuum Separator - Newest FPC FFC Pulse Heat Press Machine For Chip Bonding Jiutu – Jiutu, The product will supply to all over the world, such as: San Francisco , Curacao , Angola , More than 26 years, Professional companies from all over the world take us as their long-term and stable partners. We are keeping durable business relationship with more than 200 wholesalers in Japan, Korea, USA, UK, Germany, Canada, France, Italian, Poland, South Africa, Ghana, Nigeria etc.

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