High Quality Iphone Xs Parts - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu

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High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding Function : Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 m...

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High Quality Iphone Xs Parts - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu Detail:

High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding

Function :

Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic

Specification :

Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.

Application :

Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.

Product detail pictures:

We have advanced equipment. Our products are exported to the USA, the UK and so on, enjoying a good reputation among customers for High Quality Iphone Xs Parts - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu, The product will supply to all over the world, such as: Peru , Suriname , Plymouth , We maintain long-term efforts and self-criticism, which helps us and improvement constantly. We strive to improve customer efficiency to save costs for customers. We do our best to improve the quality of product. We will not live up to the historic opportunity of the times.

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