Factory wholesale Industrial Robots - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu

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High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding Function : Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 m...

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Our growth depends to the superior products ,great talents and repeatedly strengthened technology forces for Jiutu Alignment Mold , Glass Separating Machine , Samsung Lcd Panel Replacement , "Making the Products of High Quality" is the eternal goal of our company. We make unremitting efforts to realize the goal of "We Will Always Keep in Pace with the Time".

Factory wholesale Industrial Robots - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu Detail:

High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding

Function :

Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic

Specification :

Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.

Application :

Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.

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Our development depends on the advanced equipment ,excellent talents and continuously strengthened technology forces for Factory wholesale Industrial Robots - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu, The product will supply to all over the world, such as: Detroit , Canada , Albania , Good quality and reasonable price have brought us stable customers and high reputation. Providing 'Quality Products, Excellent Service, Competitive Prices and Prompt Delivery', we are now looking forward to even greater cooperation with overseas customers based on mutual benefits. We'll work whole-heartedly to improve our solutions and services. We also promise to work jointly with business partners to elevate our cooperation to a higher level and share success together. Warmly welcome you to visit our factory sincerely.

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