Factory wholesale Industrial Robots - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu

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High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding Function : Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 m...

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We pursue the administration tenet of "Quality is superior, Services is supreme, Standing is first", and will sincerely create and share success with all customers for S6 Edge Parts , Lcd Touch Screen Separator Machine , Packaging Box for iPhone 6 7 7 Plus , We have four leading products. Our products are best sold not only in the Chinese market, but also welcomed in the international market.

Factory wholesale Industrial Robots - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu Detail:

High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding

Function :

Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic

Specification :

Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.

Application :

Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.

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We try for excellence, service the customers", hopes to be the most effective cooperation workforce and dominator company for staff, suppliers and shoppers, realizes price share and ongoing marketing for Factory wholesale Industrial Robots - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu, The product will supply to all over the world, such as: Guatemala , Portugal , Austria , We hope we can establish long-term cooperation with all of the customers, and hope we can improve competitiveness and achieve the win-win situation together with the customers. We sincerely welcome the customers from all over the world to contact us for anything you need to have!Welcome all customers both at home and abroad to visit our factory. We hope to have win-win business relationships with you, and create a better tomorrow.

2 In 1 Cold Press