Factory For Pulse Pressing Lcd Laminating Flex Machine - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu
Factory For Pulse Pressing Lcd Laminating Flex Machine - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu Detail:
High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding
Function :
Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic
Specification :
Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.
Application :
Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.
Product detail pictures:
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All we do is usually connected with our tenet " Consumer initial, Rely on 1st, devoting around the food stuff packaging and environmental safety for Factory For Pulse Pressing Lcd Laminating Flex Machine - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu, The product will supply to all over the world, such as: Hungary , Indonesia , Niger , Besides strong technical strength, we also introduce advanced equipment for inspection and conduct strict management. All the staff of our company welcome friends both at home and abroad to come for visits and business on the basis of equality and mutual benefit. If you are interested in any of our items, please feel free to contact us for quotation and product details.
By Salome
from Netherlands
- 2018.10.31 10:02
We always believe that the details decides the company's product quality, in this respect, the company conform our requirements and the goods are meet our expectations.
By Miranda
from Ghana
- 2017.09.26 12:12
