Factory For Pulse Pressing Lcd Laminating Flex Machine - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu

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High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding Function : Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 m...

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Dependable good quality and very good credit score standing are our principles, which will help us at a top-ranking position. Adhering towards the tenet of "quality initial, shopper supreme" for Frozen Separating Machine , Large Film Laminating , 5.5 Inch Cracked Lcd Screen Refurbishment , We focus on creating own brand and in combination with many experienced term and first-class equipment . Our goods you worth have.

Factory For Pulse Pressing Lcd Laminating Flex Machine - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu Detail:

High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding

Function :

Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic

Specification :

Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.

Application :

Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.

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Normally customer-oriented, and it's our ultimate concentrate on for being not only one of the most dependable, trustable and honest supplier, but also the partner for our shoppers for Factory For Pulse Pressing Lcd Laminating Flex Machine - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu, The product will supply to all over the world, such as: Plymouth , Mombasa , Pretoria , Nowadays our merchandise sell all over the domestic and abroad thanks for the regular and new customers support. We supply high quality product and competitive price, welcome the regular and new customers cooperate with us!

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