Factory directly supply Touch Screen Lcd Oca Vacuum Laminator - 200 Degree High Temperature Hot Pressing Vacuum Laminator For Chip Bonding Jiutu – Jiutu

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200 Degree High Temperature Hot Pressing Vacuum Laminator For Chip Bonding Jiutu Function : Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minut...

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Our primary purpose is to give our shoppers a serious and responsible company relationship, giving personalized attention to all of them for Automatic Assembly Machine , Lcd Bubble Remover , Bga Chip Repair Machine For Motherboards , We warmly welcome business partners from all walks of life, expect to establish friendly and cooperative business contact with you and achieve a win-win goal.

Factory directly supply Touch Screen Lcd Oca Vacuum Laminator - 200 Degree High Temperature Hot Pressing Vacuum Laminator For Chip Bonding Jiutu – Jiutu Detail:

200 Degree High Temperature Hot Pressing Vacuum Laminator For Chip Bonding Jiutu

Function :

Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic

Specification :

Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.

Application :

Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.

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Fast and great quotations, informed advisers to help you choose the correct product that suits all your preferences, a short creation time, responsible top quality control and different services for paying and shipping affairs for Factory directly supply Touch Screen Lcd Oca Vacuum Laminator - 200 Degree High Temperature Hot Pressing Vacuum Laminator For Chip Bonding Jiutu – Jiutu, The product will supply to all over the world, such as: St. Petersburg , Denver , Venezuela , We're your reliable partner in the international markets of our products and solutions. We focus on providing service for our clients as a key element in strengthening our long-term relationships. The continual availability of high grade solutions in combination with our excellent pre- and after-sales service ensures strong competitiveness in an increasingly globalized market. We're willing to cooperate with business friends from at home and abroad, to create a great future. Welcome to Visit our factory. Looking forward to have win-win cooperation with you.

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