China OEM For Iphone 6 Lcd Display - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu

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High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding Function : Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 m...

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To create much more benefit for consumers is our company philosophy; customer growing is our working chase for For Iphone 6s Plus Display , Mobile Repairing Machines , Mobile Phone Lcd Making Machine , We warmly welcome merchants from home and abroad to call us and establish business relationship with us, and we will do our best to serve you.

China OEM For Iphone 6 Lcd Display - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu Detail:

High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding

Function :

Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic

Specification :

Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.

Application :

Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.

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Assume full duty to satisfy all demands of our clients; reach steady advancements by marketing the development of our purchasers; grow to be the final permanent cooperative partner of clientele and maximize the interests of customers for China OEM For Iphone 6 Lcd Display - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu, The product will supply to all over the world, such as: Slovakia , Switzerland , Cairo , Faced with the vitality of the global wave of economic integration, we are confident with our high-quality products and sincerely service to all our customers and wish we can cooperate with you to create a brilliant future.

Ak Vacuum Laminating Machine