2017 China New Design Frame Glass With Oca - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu
2017 China New Design Frame Glass With Oca - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu Detail:
High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding
Function :
Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic
Specification :
Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.
Application :
Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.
Product detail pictures:
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"Quality initial, Honesty as base, Sincere support and mutual profit" is our idea, so as to build repeatedly and pursue the excellence for 2017 China New Design Frame Glass With Oca - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu, The product will supply to all over the world, such as: Romania , Lesotho , Jeddah , Our products are exported worldwide. Our customers are always satisfied with our reliable quality, customer-oriented services and competitive prices. Our mission is "to continue to earn your loyalty by dedicating our efforts to the constant improvement of our items and services in order to ensure the satisfaction of our end-users, customers, employees, suppliers and the worldwide communities in which we cooperate".
By Gill
from Azerbaijan
- 2017.04.08 14:55
The sales person is professional and responsible, warm and polite, we had a pleasant conversation and no language barriers on communication.
By Ivy
from Australia
- 2018.09.29 17:23
