2017 China New Design Frame Glass With Oca - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu
2017 China New Design Frame Glass With Oca - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu Detail:
High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding
Function :
Microfluidic chip vacuum thermocompression bonding machine is a good alternative product based on soft lithography micromachining technology, which is convenient for the rapid manufacture of your microfluidic devices, using temperature and pressure control, can be achieved within minutes. Hot pressing process for various materials, it has been optimized to make Flexdym polymer molding in just 2 minutes, but can also be used to mold various other thermoplastics such as acrylic
Specification :
Mainly suitable for bonding of rigid plastic chips such as PMMA, PC, PP, COP, COC, BOPET, CBC, resin (part), polyethylene (part), etc.) The maximum temperature is 200 degrees; the maximum pressure is 10KN.
Application :
Vacuum hot press is a complete set of equipment for hot pressing materials under vacuum (or adding other gases); it mainly adopts resistance heating, which is pressurized by the indenter of the cylinder, and the solid particles of the green body are bonded to each other at high temperature. Grain growth, voids (pores) and grain boundaries gradually decrease, and the total volume shrinks through material transfer, density increases, and finally becomes a dense polycrystalline combustion body with a certain microstructure, thereby pressing the material into molding. The simultaneous action of high temperature, pressure and vacuum or gas significantly increases the density, hardness and other mechatronic thermal properties of the product.
Product detail pictures:
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Our products are widely recognized and trusted by users and can meet continuously developing economic and social needs for 2017 China New Design Frame Glass With Oca - High Pressure Max 300 Degree Hot Vacuum Laminating Machine For Silicon Wafer Bonding – Jiutu, The product will supply to all over the world, such as: Hamburg , Paris , Jeddah , We will initiate the second phase of our development strategy. Our company regards "reasonable prices, efficient production time and good after-sales service" as our tenet. If you are interested in any of our products or would like to discuss a custom order, please feel free to contact us. We are looking forward to forming successful business relationships with new clients around the world in the near future.
By Jason
from Montreal
- 2018.12.10 19:03
This company has a lot of ready-made options to choose and also could custom new program according to our demand, which is very nice to meet our needs.
By Faithe
from Austria
- 2017.11.12 12:31
